Memtron’s Poly-Tac I Construction is a popular implementation and sometimes cost-effective alternative to traditional stainless steel dome constructions.

By embossing the top layer of the membrane switch, we are able to change a traditional non-tactile switch construction to create tactile feedback. The Poly-Tac I construction fits well in conditions where the user is looking for a lower cost alternative to stainless steel domes, but has a ring or full key embossing requirement for the overlay.

• Suitable for switch applications with low key density and/or generous spacing
• Typical actuation forces are 15 +/- 3 ounces
• 1,000,000 actuation life expectancy
• Conducive to ring or full key embossing
• Suitable for Polyester, Polycarbonate, and Elastomeric overlays
• Single tail layer is ideal for ZIF or friction-fit connectors
• Operating temperature range of –20 to +50 C and storage temperature range of –40 to +75 C
• Integration into both flex circuit and PCB constructions

Attributes - printed circuit board

• An efficient design for most keypad programs regardless of key density
• Offers significant cost savings by combining a membrane switch keypad and a printed circuit board into one common assembly
• Typical actuation forces are 15 +/- 3 ounces
• Suitable for Polyester, Polycarbonate, and Elastomeric overlays
• 1,000,000 actuation life expectancy
• Conducive to ring or full key embossing
• Operating temperature range of –20 to +50 C and storage temperature range of –40 to +75 C